载体金属化镀层对SMT软钎焊接头热循环可靠性的影响

The Influence of Metal Plating of Chip Carrier on Reliability of SMT Solder Joints under Thermal Cycling

摘要: 研制了一种用于SMT软钎焊接头热循环可靠性试验的热循环发生装置和一种SMT模拟陶瓷芯片载体,用该热循环装置、模拟芯片载体和统计学方法研究了芯片载体金属化镀层对SMT软钎焊接头热循环可靠性的影响。

Abstract: An experimental setup and a simulated ceramic chip carrier for study of the SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically.